Advertisement
Advertisement
Embedded.com
electronica 2022 is back in person in Munich on 15-18 November 2022. AspenCore Media will again host the embedded forum where we’ll explore various aspects of edge intelligence and AI, sustainability, HPC, and safety critical systems.
Advertisement
As the international electronics community descends on Munich for the biennial electronica 2022 trade fair, we are pleased to once again be hosting the embedded forum and Power Electronics forum during the four days of the show, from the 15th – 18th November 2022. Both forums will take place in exhibition hall 4, booth 473.
The agenda for the four days of the embedded forum is summarized below, and you can find the full schedule here.
Embedded systems trends
The embedded forum will open with a keynote talk entitled, “Energy efficiency will be key to success in delivering the intelligent edge,”, presented by Martin Cotter, senior VP, industrial and multi-markets, Analog Devices. He will look at the link between the sustainability agenda that’s crucial nowadays on the global stage, and how intelligent edge solutions can help reduce energy consumption to meet some of those goals. He’ll explore ubiquitous sensing and connectivity at the edge that deliver the data which opens the door to operational insight capable of achieving energy efficiency.
The panel discussion following this keynote will then explore what might be the next big thing in embedded systems. We’ve now talked about edge intelligence and security as growing in importance over the last few years, but is there anything new on the horizon that will be the topic we all start focusing on and that will drive the next wave of growth? The panel, comprising Christian Eder (congatec), Martin Kellermann (Microchip), Mick McCarthy (Analog Devices), and Mark Patrick (Mouser Electronics), will have a go at identifying possibilities, and moderated by myself.
Following the panel, technical talks will include:
The AIoT future
On day 2 (Wednesday 16th November), the opening keynote will explore “Is the move to AI at the edge reality or hype?”, presented by Sailesh Chittipeddi, executive vice president, IoT and infrastructure business unit, Renesas Electronics. There’s lots of talk about AI at the edge, and our speaker will aim to demystify the hype around AI at the edge through practical use cases and examples.
The panel discussion following this keynote will ask the simple question, “How smart can we live?” With everything connected and everything intelligent, is there a limit to what we can make smart, and get real benefits? Again, I’ll be moderating the panel comprising Mario Heid (OMNIVISION), Suad Jusuf (Renesas Electronics), Pier Paolo Porta (Ambarella), and Ali Osman Ors (NXP Semiconductors).
Following the panel, technical talks will include:
AI and HPC architectures
Into day 3, and the opening keynote will look at “Trends and best practices for AI at the edge”, a talk by Dr. Ekaterina Sirazitdinova, data Scientist, Nvidia. With real-time AI inference becoming a new great challenge for embedded data processing, this talk will observe trends in embedded AI for machine vision use cases and will share some best practices for optimizing AI inference at the edge.
In the second talk of this session, we head back to the sustainability agenda. “Why ML at the edge needs more sustainable chip manufacturing,” will be delivered by Richard Price, chief technology officer, PragmatIC Semiconductor. He argues that while silicon ICs continue to deliver progressively more functionality and higher performance, this has come at a price, in terms of billions of dollars for state-of-the-art fabs, millions of dollars to design a chip and months to manufacture. Since high performance silicon is not required across all areas of the connected world, the talk will discuss approaches that are intrinsically more sustainable and can provide alternative solutions to sustainably deliver custom ML chips for end devices at mass scale.
Safety and mission critical systems
On day 4, we will have a presentation entitled, “Are containers the solution for safety and security of mission critical platforms?”, delivered by Ian Ferguson, VP sales and marketing, Lynx Software Technologies. He will explore the adoption of containers in mission critical systems and proposes paths to address some of the limitations of existing container architectures.
To close the forum, I’ll then present the preliminary findings of the latest AspenCore 2022 Mind of the Engineer survey. This survey asked engineers worldwide to tell us what’s important to them – at work and in their careers. This in-depth look at the global electronics industry sheds light on technology trends, the challenges engineers face, resources they need and those they rely on most, how they spend their time, and more.
Click here for the full agenda. In order to attend either the embedded forum or the Power electronics forum, you’ll need to have a visitor ticket for electronica 2022, which can be obtained here.
Advertisement
You must Sign in or Register to post a comment.
This site uses Akismet to reduce spam. Learn how your comment data is processed.
Advertisement
Advertisement
Advertisement